Encapsulation of electronics is an efficient way to protect individual elements from the influence of external environment. The assembled electronic modules are placed in the enclosure and filled with resin to the appropriate height of the module to cover and protect all elements of the electronic system.
The main role of this process is to flood pre-defined or positioned elements with liquid, which is left until the resin sets and the filler is completely cured. The result of this process is a hermetic construction that is integrally bound together with the housing.